Precision Process Equipment Introduces the Wafer Processing Game Changer with Excellite 1000 BCP

Niagara Falls, NY, November 04, 2009 --(PR.com)-- Precision Process Equipment Inc, finds success with recently expanded line for solar cell, semi conductor and microelectronic packaging manufacturers.

The Excellite 1000 BCP is based on the success of the Excellite FSP, which was developed for wide-web, reel-to-reel (R2R) flexible substrate plating. The 1000 BCP plates flexible CIS, CIGS and TCO coatings for thin film solar cells. It plates on silicon or glass discrete part substrates with a fully automated dry in dry out cassette-to-cassette tool set.

The Excellite 1000 BCP can be configured for pre plate deposition of seed, barrier, and conductive layers, plating of a variety of metals and performing post seed layer annealing. “We evaluated Rena and Schmeed solar wafer plating systems; the Excellite 1000 produces higher through put and superior yields on thin fragile substrates. It can produce inline deposition systems as well as other automation set-ups common to Si-Cell or glass photovoltaic production systems. It gives maximum through put and very high yields,” says Patrick Burt, President of Acteron Corporation San Carlos, Ca.

Precision Process Equipment (PPE) has been specializing in leading edge wet chemical processing systems for 40 years. PPE process offers a full line of wet processing solutions and turnkey systems for the solar, semiconductor, and microelectronics industry wet processing applications.

For Further information contact:
sales@precisionprocess.com
contact@precisionprocess.com
www.precisionprocess.com

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