Light Tack Adhesive Eases Fitting of New Silicone-Free Thermal Interface Pads
MH&W International now provides U 90 silicone-free thermal interface materials (TIMs) with a new light tack adhesive to provide high thermal conductivity where contamination threats prevent the use of silicone-based thermal pads, and allow their easy positioning between components and heat sinks. - August 08, 2010
Thermal Gap Fillers Combine High Performance and Low Pricing
New TP-S30 thermal interface pads from MH&W International provide 3.0 W/mK of thermal conductivity between hot components and heat sinks at lower costs than competing gap filler materials. - June 25, 2010
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