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Indium Corporation will feature precision gold-tin (AuSn) solder preforms for die-attach at AeroDef 2016, Feb. 8-10, in Long Beach, Calif.
AuSn preforms are designed for high-reliability applications, such as aerospace, defense, and medical.
Gold-based solder has a high melting point, ranging from... - January 07, 2016
Indium Corporation was presented with the Global Technology Award for Best Products – Americas for InFORMS® high-reliability solder preforms, on Nov. 10 at Productronica in Munich, Germany.
InFORMS® are revolutionary in their ability to provide uniform bondline thickness. An uneven solder... - December 12, 2015
Indium Corporation will feature its reinforced indium and solder alloy fabrications InFORMS® at NEPCON Japan, Jan. 13-15 in Tokyo, Japan.
InFORMS® are high-reliability solder preforms that provide a consistent bondline thickness to maximize thermal and mechanical reliability. They also allow... - December 10, 2015
Since October, Pathways in Technology Early College High School (P-TECH) Oneida-Herkimer-Madison (OHM) BOCES students have analyzed, brainstormed, and designed a real-world product packaging solution for Indium Corporation, Utica’s Technology Company®.
“We challenged the P-TECH students... - December 05, 2015
Indium Corporation's EZ-Pour® Gallium Trichloride (GaCl3) simplifies the use of gallium trichloride by allowing the user to easily transfer the product from one container to another at room temperature.
Traditional gallium trichloride is solid at room temperature and often forms clumps or sticks... - November 18, 2015
Indium Corporation presented its suite of void-reducing solder pastes, including halogen-free, no-clean Indium8.9HF, at Productronica 2015, Nov. 10-13 in Munich, Germany.
Indium8.9HF is specifically formulated to reduce or eliminate voiding for improved finished goods reliability. This paste is perfectly... - November 14, 2015
Indium Corporation announces the addition of Donna Vareha-Walsh as Director, Metals Unit. - November 11, 2015
Indium Corporation announces the release of its newest informational video that describes how solder preforms can reduce voiding in bottom termination components.
This brief video, which can be found at www.indium.com/blog/phil-zarrow, features Indium Corporation Technical Support Engineer Derrick Herron... - November 01, 2015
Indium Corporation will feature void-reducing Indium8.9HF, a halogen-free, no-clean solder paste, at Productronica 2015, Nov. 10-13, in Munich, Germany.
Indium8.9HF is specifically formulated to reduce voiding, while delivering high transfer efficiency with low variability. In addition to outstanding... - October 29, 2015
Indium Corporation announces the release of its newest informational video detailing the benefits of using low-temperature solder alloy systems based on indium and bismuth.
This brief video features the company’s Indium and Bismuth Product Manager, Carol Gowans, as she explains to electronics... - October 25, 2015
Indium Corporation announces the release of its newest informational video that guides the audience on the proper steps for selecting a solder preform.
This brief video features Indium Corporation’s Jim Hisert, Manufacturing Engineer, and SMT expert Phil Zarrow, President and Principal Consultant... - October 22, 2015
Indium Corporation announces the release of its newest informational video that provides real-world examples of drastic improvements of electronics manufacturing uptime and productivity.
This brief video features Indium Corporation Senior Technologist Dr. Ronald C. Lasky as he uses firsthand experiences... - October 18, 2015
Indium Corporation's Tim Jensen, Senior Product Manager for Engineered Solders, will lead a professional development course at the IMAPS 48th annual International Symposium on Microelectronics, Oct. 26, in Orlando, Fla.
Jensen’s course, Improving Mechanical, Electrical, and Thermal Reliability... - October 17, 2015
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