Micralyne Presents Gold-Tin Solder Bonding Process for Wafer-Level Packaging

Micralyne Inc., a growing MEMS and microfluidics foundry, announced today that Project Engineer, Mr. Dean Spicer, will be speaking next week at The 2009 IEEE International Interconnect Technology Conference (IITC) on Tuesday, June 2.

Edmonton, Canada, June 02, 2009 --(PR.com)-- The attendees of the twelfth IITC conference, located in Sapporo, Hokkaido, Japan, will take in Mr. Spicer’s poster session from 1.30 p.m. until 3:30 p.m. at the Royton Sapporo Hotel, Royton Hall A/B.

Spicer will be presenting on the topic Thin-Layer Au-Sn Solder Bonding Process for Wafer-Level Packaging, Electrical Interconnects and MEMS Applications. The results being presented were obtained within a development program for a MEMS-based memory device. Wafer-to-wafer bonding is a key process in MEMS wafer-level packaging (WLP).

The developed MEMS wafer bonding process utilizes gold-tin solder electroplating and provides liquid-proof sealing and multiple reliable electrical connections between the bonded wafers. The wafer bond can withstand 300ºC and features a thin bond line (2-3 ?m), high bond strength, excellent bond gap control, and low stress due to small amount of bonding material.

Micralyne Inc.
Craig Blackburn