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Advanced Thermal Solutions, Inc.

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Semiconductor Equipment Company Receiving Lower Cost, Higher Quality Thermal Management Solutions from ATS

A major manufacturer of test equipment for the semiconductor industry needed to reduce the costs of certain heat sink assemblies. Rather than choosing off-shore heat sinks they worked with ATS to meet their goals.

Norwood, MA, August 05, 2011 --( Many US manufacturers have learned that cost advantages from using overseas cooling products, such as heat sinks, are outweighed by the reliable performance of ATS thermal management solutions. One such OEM, an industry leading semiconductor test equipment company, took such an approach. The result was significant cost and performance advantage.

The Massachusetts based semi-conductor test company has been using various ATS heat sinks, heat sink clips and other thermal management solutions for cooling inside some of its test systems. But market demands called for price reductions by all suppliers. For their thermal management supplier, the OEM singled out three heat sinks for price reductions: ATS heat sinks 1174, 1175 and the 1176.

ATS had originally designed these heat sinks with a good deal of margin in them for the customer’s applications, as they were used on multiple projects. The additional thermal headroom gave the customer what they wanted: a rock solid thermal management design with little risk of overheating. However, as the product and market matured it was clear to this customer that cost reductions would be paramount for their continued success.

ATS thermal engineers approached the customer’s cost reduction methodically. Though the customer’s systems were known and the heat sinks an ATS design, ATS felt that taking a new baseline would insure a clear understanding on the system’s current thermal envelope. An understanding of the problem included understanding the thermal characteristics of the semiconductors involved, the chassis airflow, PCB design, and potential for thermal coupling from device to device.

ATS engineers performed CFD using CF Design from Autodesk’s Blue Ridge Numerics. Thermal analysis was performed using laboratory airflow studies to characterize the available cooling air in the customer’s systems under normal working conditions. ATS work resulted in a design that was still reliable, even though cost and performance reduced. ATS reached all the necessary price and performance targets. Because the customer invested in the long term engineering relationship with ATS, they were able to realize cost savings and product innovation from an existing, trusted advisor and supplier.

Advanced Thermal Solutions, Inc (ATS) is a leading engineering/manufacturing company focused on the thermal management of electronics. Their most current innovation, MxiPKG, resets the bar for thermal management of semiconductors

Founded in 1989 as a consulting company, ATS has evolved to a complete thermal solutions provider and is world renown for its portfolio of more than 450 high- and ultra performance heat sinks, research-quality test equipment, and leading-edge R&D. In the interval of three years, ATS has established its own manufacturing center in the US, developed strategic partnerships with Asian manufacturers and opened ATS-Europe, its sales and engineering office in Holland. As ATS has significantly increased its customer base, its product offerings have also expanded to include Advanced Fan Trays, Liquid Cooling Systems, Advanced Cooling Systems and Next-Generation Thermal Test Instruments.

To learn more about how ATS heat sink design services can help your firm achieve cost and performance advantages, please visit

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Advanced Thermal Solutions, Inc.
John O'Day

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