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coolingZONE 11th Annual Summit Brings Thermal Engineering Conference to Cambridge, MA on October 5

The 11th Annual coolingZONE Summit is being held October 5-6, 2011 at the Royal Sonesta Hotel in Cambridge, MA The Summitís agenda includes two days of engineering presentations on heat transfer and thermal management from industry experts.

Cambridge, MA, August 17, 2011 --( coolingZONE announced today that its 11th International Business and Technology Summit is now in Cambridge MA, USA the heartland of high technology and business education, including MIT and Harvard University. The 11th Annual Summit is being held October 5-6, 2011 at the elegant Royal Sonesta Hotel located along the historic Charles River.

In this inspiring venue, the coolingZONE Summit gathers together world renowned experts in thermal management, thermal engineering and heat transfer to share their latest developments and research, and discuss emerging technologies for advanced cooling of electronic systems.

Engineers across the globe attend the Summit to learn what new cooling challenges will confront them, where the solutions will be found, and who can help them with effective products and services to manage today’s thermal challenges.

The Summit’s agenda includes two full days of technical presentations from leading experts in industry and academia. Short technical sessions will be provided by corporations who are advancing the thermal management community with innovative and practical thermal solutions.

Topics to be presented in Summit 2011 include: Thermal and Energy Management Technologies for the Next Decade: Challenges and Opportunities; Challenges and Innovations in Avionics and Military Electronics Thermal Management; An Overview of the Challenges in Thermal Testing; Challenges of Thermal Management and Design of Compact 3-D Microsystems: An integrated System Level Approach with Focus on Discrete Technologies; Thermal Design and Management of High Power LEDs; The Future of Solid State Lighting is Bright but “Why is it Taking so Long?”; Design of Liquid Cooled Heat Sinks and Cold Plates: Some Fundamental Concepts for Transitioning from Air Cooled Solutions; Thermal Engineering Challenges at the Device and Microprocessor Levels; Thermal Design of Telecommunications Equipment: Challenges and Requirements Perspectives on Electronics Thermal Management from Academia to Industry.

For more information, visit or email: or call the coolingZONE team at 508-329-2021

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coolingZONE, LLC
Debbie Sheikholeslami

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