Norwood, MA, December 11, 2011 --(PR.com
)-- Continuing advances in packaging and die technology are increasing the demands for thermal management. One result is pressure on engineers to replace standard heat sinks with optimized, higher performance designs. Optimized heat sinks offer more performance with less weight, in a smaller spatial volume, than off the shelf designs. This allows the use of higher frequency components, and ideally leads to higher performing end products. Despite these benefits, because of PCB layout and system configuration, there is no one simple method for optimizing heat sink geometry to guarantee increased performance. One such a way to optimize the heat sink is optimizing the air flow to the heat sink by relaying out the components for optimal flow, and/or optimizing the heat sink design to minimize pressure drop in a PCB.
ATS’s latest webinar, “Design Out Your Heat Sinks with Smart PCB Thermal Design” will show attendees how to optimize air flow over the PCB. Attendees will learn to design for the least number of heat sinks and potentially none at all. A case study will be presented as a model of what can be accomplished by considering the thermal management solution up front in system design.
ATS’s latest webinar, “Design Out Your Heat Sinks with Smart PCB Thermal Design” is being held December 15th, 2PM EST. To register, please visit http://www.qats.com/Training/Webinars/7.aspx.
Advanced Thermal Solutions, Inc. (ATS) is a leading engineering/manufacturing company focused on innovations in the thermal management of electronics. Founded in 1989 as a consulting company, ATS has evolved to a complete thermal solutions provider and is world renowned for its product and service portfolio including more than 450 high and ultra-performance heat sinks, research-quality test equipment, leading-edge R&D, thermal engineering consulting and thermal management education.