TechNexion Kicks Off Embedded World with Cutting-Edge Embedded Systems and Other New Products
TechNexion today unveiled its next-generation System on Modules, Embedded Mainboards, Fanless Computing, Panel Computing and Internet of Things devices along with other solutions at the annual embedded world exhibition and conference in Nürnberg, Germany. This year, TechNexion booth is located at Hall 1, Stand 1-311. - March 17, 2017
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