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TechNexion Kicks Off Embedded World with Cutting-Edge Embedded Systems and Other New Products

TechNexion today unveiled its next-generation System on Modules, Embedded Mainboards, Fanless Computing, Panel Computing and Internet of Things devices along with other solutions at the annual embedded world exhibition and conference in N├╝rnberg, Germany. This year, TechNexion booth is located at Hall 1, Stand 1-311.

Nuermberg, Germany, March 17, 2017 --( TechNexion product line-up has grown once again in size. For this year’s embedded world show, TechNexion continues to build on its complete lineup of EDM and PICO Series System on Modules designed for modular, versatile, scalable and low-power applications. Static and live demos are showcasing the latest TEP Series human-machine-interface (HMI) panel computing devices. The TEP Series features a flux mounted projective capacitive touch with high brightness LCD display ranging from 5 to 15.6 inches embedded in a IP65/NEMA4x rated brushed aluminum bezel design. In addition to TechNexion robust lineup of SOM's and HMI's, the company is launching new fanless industrial Box PCs. The TEK Series fanless computing systems are enclosed in a compact, fully ruggedized enclosure, and are perfect for controlling versatile end-equipment. Internet of Things product group showcases PIXI Series modules. This series modules enable secure, low-energy and long range connectivity for smart IoT devices like home and building automation or healthcare.
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Tomasz Swatowski

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