Sunrise, FL, December 18, 2009 --(PR.com
)-- Sunrise Optical LLC has added a new Interferometric Probe Option to Zebra OptoProfiler (CT-IR) for substrate topography, and thickness metrology. Zebra CT-IR option uses infrared (IR) interferometric technique, which provides accurate substrate thickness measurement and thickness variation (TTV) of thick to ultra-thin wafers for in-situ grinding, etching and deposition applications. Most of materials transparent in IR beam, such as Si, GaAs, InP, SiC, Glass, Quartz and many polymers are readily measured with standard spatial resolution of 50 microns spot, (smaller spot sizes are available). Using a single probe system, substrate thickness of conventional wafers with patterns, tapes, bumps or bonded wafers mounted on carriers can be determined with high precision and accuracy.The CT-IR sensor employs infrared (IR) interferometric technique, which provides a direct and accurate substrate thickness measurement and thickness variation (TTV) of thick to ultra-thin wafers for in-situ grinding, etching and deposition applications. Various specialized applications including Membrane Thickness and Bump Height metrologies applications have been developed. Other options available include trench depth and via holes, including high aspect ratio trenches and vias in MEMs type applications. Data can be exported in text format and analyzed by third party data analysis software packages.Product AvailabilitySample measurement service is now available. Lead-time for tool is currently 4 to 8 weeks ARO.
About Sunrise Optical LLC: Sunrise Optical LLC is an optical metrology company located in Sunrise FL. It specializes in design and manufacturing of spectroscopic and imaging systems for three-dimensional (3D) image acquisition and development of new algorithms for three-dimensional (3D) image processing. Sunrise Optical LLC is serving the solar cell manufacturing, MEMs, and thin film metrology markets. More information on Sunrise Optical LLC can be found on company website www.zebraoptical.com.