EVOC Exhibits at Embedded World 2010

Shenzhen, China, March 06, 2010 --(PR.com)-- March 2-4, 2010, the Embedded World was held in Nuremburg, Germany. Taking place in early March each year, the Embedded World remains the world's undisputed biggest get-together for the international embedded community. A great platform for the release of the world's cutting edge technologies and products, the trade fair reflects to a certain degree the trends of embedded industry for the next two years. During the three-day event, around 450 world-renowned manufacturers coming from over 30 countries gathered here to exhibit their latest or soon-to-released technologies and products. Among them were Intel, Microsoft, Siemens, ABB, Fuji, Panasonic and EVOC. As a regular exhibitor for this annual event in the embedded and industrial PC industry, EVOC garnered considerable visitor attention by showcasing its latest industrial motherboards based on Intel technology, small-sized low-power box PCs, the most cutting-edge notebook computers and other rugged series product.

JNB-1404

Full Rugged and EMC/EMI Compliant Laptop

JNB-1404 possesses wide temperature range, waterproof and dustproof capabilities, salt fog resistance, anti-vibration and anti-drop performance, portability, ruggedness, powerful mobile computing capability, adaptability to harsh environments, high reliability and stability.

Anti-shock & Anti-vibration: MIL-STD-810F
Processor & Chipset: Intel® Core™ 2 Duo + Intel® GME965 + ICH8-M; Intel® L7500/1.6GHz/800MHz
Memory: Onboard 512MB + 1 x SODIMM, supporting 2GB + 512MB DDR2 667
Ethernet & I/O Interface: Supports 1 x 1000Mbps, 3 x USB2.0, 2 x RS232/485, 1 x PCMCIA Type Ⅱ
Operating Temperature: -20℃~+55℃
Relative Humidity: 40℃, 5%-95%
IP Level: IP54
EMC/EMI: MIL-STD-461E

ETX-1813CLNA

Low Power ETX 3.0 Modular Computer with Intel® Latest Embedded Platform

An ETX3.02 compliant embedded computer, ETX-1813CLNA contains onboard Intel® latest Atom™ platform, ultra low power Pineview M processor, onboard 1GB DDR2 memory and abundant I/O ports. As an embedded system which supports secondary development and customization, ETX-1813CLNA can be used for a wide range of embedded applications in electric power, transportation, medical care, aviation and aerospace, etc.

TDP: 13.514watt
Dimensions: 114mm x 95mm
Processor & Chipset: Intel® Pineview M 1.66GHz + Intel® ICH8M
Memory: Onboard 1GB Memory
Ethernet & I/O Interface: Onboard 1 x 100Mbps, 4 x USB2.0, 1 x RS232, 1 x RS232/422/485
Operating Temperature: -40℃~+85℃
Relative Humidity: 40℃, 5%-95%
Linux: Kernel 2.6.28

COM-1814CLNAR

Low Power COM-Express Modular Computer with Intel® Latest Embedded Platform

COM-1814CLNAR is a COM-Express standard motherboard based on PCI Express, SATA, USB2.0, LVDS, SDVO and other differential display technologies. COM-1814CLNAR also supports traditional PCI bus. Its modular design facilitates users’ second development and product upgrade. COM-1814CLNAR contains Core™ 2 Duo processor and DDR3 dual-channel memory, which improves the processing capability of the embedded computing modules. This product can be widely used in electric power, medical care, automatic control, aviation & aerospace, and some other fields.

TDP: 11.38watt

Dimensions: 125mm x 95mm

Processor & Chipset: Intel® Core™ 2 Duo T9400 + Intel® GM45 + ICH9M
Memory: 2 x SODIMM, supporting DDR3 800/1066 up to 8GB
Ethernet & I/O Interface: Onboard 1 x 1000Mbps, 8 x USB2.0, 3 x RS232, 1 x RS232/422/485
Operating Temperature: 0℃~+60℃
Relative Humidity: 40℃, 5%-95%
Linux: Kernel 2.6.23

MEC-5004
Compact Fanless Embedded Box PC with Low Power Core™ 2 Duo Platform
MEC-5004 is a fanless embedded box PC based on dual-Core™ low power Core™ 2 Duo. Shaped with al-alloy, its chassis features excellent sealing, dustproof, heat dispersion and anti-vibration capabilities. Its motherboard contains Intel® Core™ 2 Duo U7500 and DDR2 memory, supports VGA and DVI independent dual display. The product can be widely used for in-vehicle navigation system, intelligent traffic, digital video monitoring and many other applications.

Anti-Shock: 10g/11ms
Anti-Vibration: 5-19Hz/1.2mm; 19-200Hz/1.2g
Dimensions: 265mm x 240mm x 100mm
Processor & Chipset: Intel® Core™ 2 Duo U7500 + Intel® GME965 + ICH8M
Memory: 1 x SODIMM, supports DDR2 400/533/667 up to 2GB
Ethernet & I/O Interface: Supports 2 x 1000Mbps, 6 x USB2.0, 5 x RS232, 7 x RS232/422/485
Operating Temperature: -10℃ - +55℃
Relative Humidity: 40℃, 5%-95%
Expansion: 1 x PCI, 1 x PCI-E x4

###