High-Power Simulators Replicate Heat Dissipation
The HP-97 high-power component simulators are now available from Advanced Thermal Solutions. The thermal simulators are useful for replicating high heat semiconductors, PCB and other devices for testing, debug, and thermal analysis.
Norwood, MA, August 25, 2010 --(PR.com)-- The HP-97 features a 32 x 32 mm aluminum block and a cartridge heater embedded within a high temperature DERLIN® housing and mounted to an FR4 plate. DERLIN® is known for its stiffness, dimensional stability, impact resistance, and structural strength.
Each component simulator has a temperature range of ambient to 110 °C, ideal for most heat sink testing applications. Each unit is designed to fit within most laboratory bench top, open loop and closed loop wind tunnels. A power source is required for operation and is not included.
The typical application for the HP-97 component simulator is to simulate high heat semiconductors or those with projected hot spots. Heat sink characterization and side-by-side heat sink comparison can then be performed to develop the right thermal management solution.
Customers who need the features of the HP-97 but only for one specific project can save money by engaging with ATS to perform all the necessary thermal characterizations for them.
For more about the HP-97 component simulator, go to:
http://www.qats.com/Products/Wind-Tunnels/Wind-Tunnel-Accessories/HP-97/2577.aspx
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Each component simulator has a temperature range of ambient to 110 °C, ideal for most heat sink testing applications. Each unit is designed to fit within most laboratory bench top, open loop and closed loop wind tunnels. A power source is required for operation and is not included.
The typical application for the HP-97 component simulator is to simulate high heat semiconductors or those with projected hot spots. Heat sink characterization and side-by-side heat sink comparison can then be performed to develop the right thermal management solution.
Customers who need the features of the HP-97 but only for one specific project can save money by engaging with ATS to perform all the necessary thermal characterizations for them.
For more about the HP-97 component simulator, go to:
http://www.qats.com/Products/Wind-Tunnels/Wind-Tunnel-Accessories/HP-97/2577.aspx
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Contact
Advanced Thermal Solutions, Inc.
Andrea Koss
781-769-2800
www.qats.com
Andrea Koss
781-769-2800
www.qats.com
Contact
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