Norwood, MA, April 09, 2011 --(PR.com
)-- Hot BGA (ball grid array) component issue on a ATCA circuit card was resolved inexpensively by attaching economical straight fin heat sinks from Advanced Thermal Solutions, Inc. (ATS).
The card’s metal enclosure, adjacent boards, and distance from the cabinet fans meant that only a small volume of airflow was passing over the hot BGA. A passive heat sink solution was required and ATS met the cooling needs by providing a 60 x 60 mm (2.36 x 2.36 in) extruded aluminum heat sink just 25 mm (0.98 in) high. The heat sink attached easily to flat BGA package with an OEM-supplied double-sided thermal adhesive tape. The ATS heat sink specified was the ATS060060025-SF-16X
The heat sink’s thermal resistance is just 1.16°C/W in the limited 1.0 m/s airflow, allowing it to transfer heat by convection from its fin field into the surrounding air and keep the component die within its required temperature limit.
The sink’s 60 x 60 mm footprint matched the BGA dimensions, so there were no fitting issues on the tightly populated PCB. The result was the hot circuit card component’s internal junction temperature was maintained below the manufacturer’s specified limit, preserving its performance and lifespan.
The ATS heat sink is made from solid extruded aluminum void of the interfacial thermal resistances in bonded fin heat sinks. The lightweight aluminum allows the sink to be attached with an inexpensive thermal adhesive tape.
More information on economical straight fin heat sinks is available from the Advanced Thermal Solutions website, www.qats.com, by emailing ATS at
email@example.com or by calling us at 781-769-2800.