La Jolla, CA, March 16, 2016 --(PR.com
)-- DINI Group
announces successful integration of the EXOSTIVTM FPGA Debug Solution
with their Xilinx UltraScale
series of ASIC Prototyping Products. The EXOSTIVTM solution enables FPGA debug at very high data rates into a large external memory (up to 8GB).
“We solved a difficult network test fixture bug using the bright orange EXOSTIVTM box, proving the value of the EXOSTIVTM solution,” said Mike DINI, president of DINI Group. “Our live TOE_IoT
demonstration was crashing after 20 seconds of continuous operation. ChipScope Pro ILA and other debug solutions weren’t providing nearly enough memory depth. Network capture boards, which cannot handle 10GbE at >90% bandwidth were dropping packets. This lack of visibility made the debug process significantly more complicated, bordering on impossible. The EXOSTIVTM solution gave us deep debug memory depth at full bandwidth. We were able, in short order, to find and fix the Verilog bug in the test fixture.”
No custom hardware interfaces were required since the EXOSTIVTM box cables directly to SFP/QSFP sockets, which are native to DINI Group’s Virtex-7 and UltraScale products. The tools were easy to use and intuitive. The logic added internally to the FPGA by the EXOSTIVTM tools was minimally invasive and did not affect the timing of the design.